Taiwan Nano & Micro-Photonics, the world's first company to develop silicon photonic sensing chips based on Si-CMOS processes, recently announced the successful completion of a new round of fundraising. This round of funding has attracted investments from several prominent enterprises including Far EasTone Telecommunications, YEM CHIO Group, and GWO XI STEM CELL APPLIED, highlighting strong market endorsement of Taiwan Nano & Micro-Photonics' technological capabilities. Following this fundraising, the company's capital will increase from NT$260 million to nearly NT$500 million, with the raised funds earmarked for continued product development and market expansion.
Titan Chang, Chairman of Taiwan Nano & Micro-Photonics, remarked, "The investment and collaboration from companies like Far EasTone Telecommunications mark them as new strategic partners for us, underscoring industry confidence in the future of the semiconductor silicon photonics sector. We look forward to working together to drive technological innovation and industrial advancement in Taiwan, ushering in a new era of technology and creating limitless possibilities for human lifestyles."
According to data from SEMI, the international semiconductor industry association, the global silicon photonics market is projected to grow from USD 12.6 billion in 2022 to USD 78.6 billion by 2030, with a compound annual growth rate of 25.7%. Applications span optical communications, data centers, sensors, biomedical fields, and beyond.
Taiwan Nano & Micro-Photonics has successfully developed high-performance silicon photonic sensing chips using Si-CMOS processes, characterized by high integration, superior data transmission, energy efficiency, and precision sensing capabilities. These chips have broad application prospects, offering strong competitiveness in areas such as AI, 5G, IoT, and smart networks. This successful fundraising will accelerate Taiwan Nano & Micro-Photonics' technical development and international market penetration.
Titan Chang further stated, "Our products integrate multiple functions into a single chip and leverage Si-CMOS processes, providing cost advantages and competitive pricing. In the future, enhanced product integration will not only reduce client-side manufacturing costs but also maintain original product dimensions without the need for redevelopment. We anticipate breakthrough developments in emerging technology areas such as 5G applications, AI, IoT, and smart cities."